Cooler Master S2H-PGKES-L5-GP LGA771 2U Heatsink
Passive solution. For Intel Xeon (Woodcrest, Wolfdale-DP) processor in 2U rack-mounted server
Application System: 2U+ Form Factor Passive Solution
CPU Type: Intel Xeon (Woodcrest, Wolfdale-DP)
Socket Type LGA 771
Heat Sink: Aluminum extrusion
Dimension: 89×79×51 MM
Fastener: Screw + Spring
Interface Material: Shin Etsu 7783
Mass: 438 g
CEK Spring: Provide by Motherboard
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